Applied QED Solutions - Consulting Services/Thermal Modeling & Analysis

Thermal Modeling & Analysis

The engineering analysts at Applied QED Solutions are ready to consult on the thermal issues facing your product designs. Our experts have extensive industry experience and they can assist you with your requirements. The goal is to provide timely, practical, and accurate thermal analyses. The analysts at Applied QED Solutions strive to understand applied heat transfer problems involving natural and forced convection, radiation, and thermal conduction.

Service examples include:

Unit Level: Cabinets, racks, consoles, chassis and/or case finite element modeling Enclosure heat transfer assessment External transient and steady state environmental responses Fluid flow assessment including cold plate or gaseous channel cooling External fin optimization BTU and Fire Worthiness Analysis

Circuit Board / Module Level: Unit level to board sub-assembly Board system level environmental assessment Contact interface cooling Convective and radiative cooling Board level temperature profiling Heat flux mapped board area evaluations Board level thermal enhancement evaluation

Component Level Analysis: Outlier component determination Thermal enhancement effect predictions Detailed individual component modeling

Understand the interrelationship of electronics to one another in selected mission and qualification environmental conditions and as encased in your product design. Call on the expertise of Applied QED Solutions to help you with your thermal design needs.

Consulting@AppliedQEDSolutions.com