Applied QED Solutions - Consulting Services/Structural Modeling & Analysis

Structural Modeling & Analysis

The Structural Engineers at Applied QED Solutions are qualified to consult on all of the structural design issues facing your products. Our experts have extensive industry experience in both military and commercial electronics. Applied QED Solutions' staff of engineers can assist you with all of your design requirements, including electronic components (e.g. magnetic designs for severe environments). Our goal is to provide our customers with structural analyses and design solutions within budget and on time. Trade studies for alternate materials and designs are easily performed within the design effort.

The analysts at Applied QED Solutions will provide expert solutions for structural problems involving severe environments including shock, sine and random vibration, acoustics, low and high cycle fatigue; as well as, Life Predictions, pwb design, and component lead design involving such criteria as Miner's Cumulative Damage Index (MCDI) predictions, Eigenvector/Eigenvalue frequency predictions, and Steinberg-type analyses.

Typical methodology would include the following three levels of analysis:

Unit Level: Housing, cabinet, rack, console, or chassis analysis and design for high Reliability enclosures in environments, such as those defined within MIL-STD-810 and RTCA DO-160, with design solutions for surviving these environments.

Module Level Structural Analysis and Design: After a determination has been made with respect to the chassis responses, the electronic modules are evaluated for high and low cycle fatigue, deflection, materials strength, and natural frequency for coupling to the chassis. Design solutions are provided to allow for high reliability.

Component Level Structural Analysis and Design: At the electronic component level, analyses are performed to determine the design requirements for lead / solder joint strength and survivability with respect to the applicable environments. Design solutions are offered to ensure a high Reliability design using such methods as Steinberg component MDI assessment and detailed individual component modeling for stresses such as those associated with coefficient of thermal expansion (CTE) mismatch.

Determining and understanding the response of the electronics within the housing to the required environmental conditions is critical. Call on the expertise of Applied QED Solutions to help you with your structural design needs.

Consulting@AppliedQEDSolutions.com